Electronic Substrates
The way a substrate is polished can make or break the success of your wafer, device and technology. We go beyond the consumable with our polishing slurries. At Saint-Gobain, we recognize that every processing step requires both a detailed review of the individual process and material and a broad review of all other finishing steps. From engineered slicing to optimized grinding to cost-effective lapping and precision polish or CMP, we look forward to helping you maximize throughput, minimize defectivity and reduce your device cost.